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Z520 Hard SIS Hot Melt Pressure Sensitive Adhesive for Product Assembly, Excellent High Temperature Resistance
| Place of Origin | China |
| Brand Name | UNISN |
| Certification | ROSH/VOC/REACH |
| Model Number | Z520 |
| Document | Z520 TDS EN.pdf |
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Z520 Hard SIS Hot Melt Pressure Sensitive Adhesive for Product Assembly, Excellent High Temperature Resistance
Product Details
Related Industry:
Packaging Manufacturing
Color:
Transparent Natural Blocks
Applicable Substrates:
EPE, EVA
Working Temperature:
155-175℃
Softening Point:
95±5℃
Highlight:
Z520 pressure sensitive hot melt adhesives
,high temperature resistant assembly adhesives
,product assembly line hot melt glue
Payment & Shipping Terms
Packaging Details
20kg/carton
Delivery Time
5-7workdays
Payment Terms
T/T
Supply Ability
30,000 tons/year
Product Description
Z520 Hard Hot Melt Pressure Sensitive Adhesives
Product Overview
This thermoplastic adhesive series is specially formulated for product assembly lines, featuring exceptional high temperature resistance. The compound is created using thermoplastic elastomers SBS and SIS, fully hydrogenated petroleum resin, naphthenic oil, and other premium components.
Primary Applications
Specifically designed for bonding EPE foam/hollow plastic boxes and EVA adhesive EPE products in industrial assembly operations.
Performance Characteristics
- Strong Adhesion & Wide Temperature Range: Excellent bonding performance for EVA/EPE materials across various temperature conditions
- Superior High Temperature Resistance: Maintains fixation and slip resistance at elevated temperatures up to 55°C with reliable tensile strength
- 100% Hydrogenated Petroleum Resin: Enables extended continuous production cycles without carbonization, reducing downtime and cleaning frequency
- Crystal Clear Formulation: Transparent adhesive free from impurities for clean, professional bonding applications
Industrial Advantage: Optimized for assembly line efficiency with reduced maintenance requirements and consistent performance under thermal stress conditions.
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